XCVC1502-2MSIVSVA2197 System On Chip (SoC)_HK Quantum International_integrated circuit ic_relay_electronic components _connector_transformer_discrete semiconductor_PCBA_development board_core board

XCVC1502-2MSIVSVA2197

Product classification

System On Chip (SoC)

Manufacturer

Xilinx (AMD)

Type

IC VERSAL AI-CO

Encapsulation

Package

Tray

RoHS

YES

Price

$26,593.7500

Available options

Quantity

Stock : 0

Not satisfied with the price? Please fill in the information and send an RFQ quickly below, and we will respond immediately.

Specifications

PDF(1)

TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ AI Core
Package	Tray
Product Status	ACTIVE
Package / Case	2197-BFBGA, FCBGA
Speed	600MHz, 1.4GHz
RAM Size	256KB
Number of I/O	586
Operating Temperature	-40°C ~ 110°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ AI Core FPGA, 800k Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	2197-FCBGA (45x45)
Architecture	MPU, FPGA