XCVC1502-2LSENSVG1369
  • image of System On Chip (SoC)> XCVC1502-2LSENSVG1369
XCVC1502-2LSENSVG1369
Product classification
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Type
IC VERSAL AI-CO
Encapsulation
Package
Tray
RoHS
YES
Price
$20,802.5000
Available options
Quantity
Stock : 0
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Specifications
PDF(1)
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case1369-BFBGA, FCBGA
Speed450MHz, 1.08GHz
Number of I/O500
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 800k Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-FCBGA (35x35)
ArchitectureMPU, FPGA
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