W66BP2NQUAHJ
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W66BP2NQUAHJ
Product_Category
Memory
Manufacturer
Winbond Electronics Corporation
Type
2GB LPDDR4, DDP
Encapsulation
Packages
Tray
RoHS
NO
Price
$7.2100
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Specifications
PDF(1)
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency2.133 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization64M x 32
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00852-3460 5868
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