100-1471-2
  • image of Microcontrollers, Microprocessor, FPGA Modules> 100-1471-2
100-1471-2
Product_Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Becom Electronics
Type
IC MODULE CM-I.
Encapsulation
Packages
Bulk
RoHS
YES
Price
{{title}}
{{description}}
captcha
{{btnStr}}
Specifications
PDF(1)
PDF(2)
PDF(3)
TYPEDESCRIPTION
MfrBecom Electronics
Seriesi.MX
PackageBulk
Product StatusOBSOLETE
Connector TypeExpansion 3 x 100
Size / Dimension3.150" L x 1.770" W (80.00mm x 45.00mm)
Speed1GHz
RAM Size1GB
Operating Temperature0°C ~ 70°C
Module/Board TypeMPU Core
Core ProcessorCM-i.MX53
Flash Size2GB (NAND), 4MB (NOR)
related
TE0722-04-41C-4-A
TE0722-04-41C-4-A Trenz Electronic
$72.0000
TE0813-02-2AE81-A
TE0813-02-2AE81-A Trenz Electronic
$363.7500
G650-05369-01
G650-05369-01 OKdo
$151.7900
FORLINX-FET6254-C+142GSE8GIB11
FORLINX-FET6254-C+142GSE8GIB11 Forlinx Embedded
$65.0000
FORLINX-FET1046A-C+182GQE01IA13
FORLINX-FET1046A-C+182GQE01IA13 Forlinx Embedded
$260.0000
00852-3460 5868
i