| TYPE | DESCRIPTION |
| Mfr | Chip Quik, Inc. |
| Series | - |
| Package | Bulk |
| Product Status | ACTIVE |
| Features | Closed Frame |
| Mounting Type | Surface Mount |
| Type | SOIC |
| Operating Temperature | -40°C ~ 130°C |
| Number of Positions or Pins (Grid) | 80 (2 x 40) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Housing Material | Polyamide (PA6T), Nylon 6T, Glass Filled |
| Pitch - Mating | 0.050" (1.27mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 39.4µin (1.00µm) |
| Pitch - Post | 0.050" (1.27mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 39.4µin (1.00µm) |
| Contact Resistance | 20mOhm |
| Current Rating (Amps) | 1 A |
