4850-10-0610-0200 RFI and EMI - Contacts, Fingerstock and Gaskets_HK Quantum International_integrated circuit ic_relay_electronic components _connector_transformer_discrete semiconductor_PCBA_development board_core board

4850-10-0610-0200

Product_Category

RFI and EMI - Contacts, Fingerstock and Gaskets

Manufacturer

Parker Chomerics

Type

RFI COND FOAM U

Encapsulation

Packages

Digi-Spool®, Continuous Spool

RoHS

YES

Price

$50.0900

Specifications

PDF(1)

TYPE	DESCRIPTION
Mfr	Parker Chomerics
Series	SOFT-SHIELD® 4850
Package	Digi-Spool®, Continuous Spool
Product Status	ACTIVE
Material	Urathane Foam w/ Silver Fibers
Length	Enter Number of Feet in Order Quantity
Shape	Sheet
Type	Conductive Foam
Width	24.016" (610.00mm)
Operating Temperature	-40°C ~ 70°C
Height	0.079" (2.00mm)

$239.3100

$0.5300

$136.3100

$33.5000

$22.0000

00852-3460 5868